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Showing posts tagged 'edge computing'


29 September 2021

Communications including 5G will drive the components market

5G

According to IC Insights, the communication sector’s share of integrated circuit sales reached 35% in 2020 and is expected to grow to 36.5% by 2025. For perspective, the automotive sector’s share of integrated circuit sales was 7.5% in 2020 and will grow to 9.8% by 2025 - significantly less than communications.

Industry tailwinds

What’s driving such high demand for ICs in the communications sector?

There are four big tailwinds:

  • 5G
  • Edge computing
  • Internet of Things
  • AI (artificial intelligence), MI (machine learning) and data analytics

5G

5G is the main driver for components demand, with 5G infrastructure rollout happening slowly, but surely. We are nowhere near a complete version of 5G, and networks are in a race against time to deliver a reliable service.

The first step for networks is replacing low-band 4G spectrum, followed by mid-band spectrum that uses 2.5, 3.5 and 4.5 GHz, enabling faster data speeds. The final step is the rollout of millimetre wave, which enables true 5G speeds. Millimetre wave also happens to be a precursor for next-generation 6G.

On top of 5G infrastructure rollout you have more 5G-enabled devices coming to market, such as smartphones, tablets and laptops. Smartphones, in particular, are leading the way for 5G adoption, putting faster data in our hands.

The rapid growth in IC demand in the communications sector also stretches to other components like modems, memory and antennas. 5G isn’t just an IC boon - it’s a boon for all the electronic components needed for 5G. 

Edge computing

Second to 5G we have edge computing, which by a miraculous twist of fate is needed to deliver a 5G experience (and needs a whole lot of components).

Edge computing puts compute capabilities relatively close to end users and/or IoT endpoints. In doing so, it reduces latency, while 5G delivers faster data speeds, providing a seamless experience on certain devices.

Internet of Things

IoT describes a network of connected smart devices that communicate with each other. For example, a vital sign monitor in a hospital could communicate with medicine dispensers and automate medicine dosages for doctors.

The Internet of Things has been talked about as a trend for several years, but we now have real applications that are useful.

AI (artificial intelligence), MI (machine learning) and data analytics

AI (artificial intelligence), MI (machine learning) and data analytics require enormous, powerful data centres to power them. These data centres require significant investment in chips, memory and other electronic components.

Also, AI, MI and data analytics need cloud computing, edge computing and in some cases 5G to deliver a real-time experience.

The future

By 2025, the communications sector is forecast to have a 36.5% usage share of integrated circuits, making it the biggest consumer of semiconductors.

Demand for integrated circuits, discrete circuits, optoelectronics and sensors will grow to an all-time highs thanks to the industry tailwinds in this article. The future is bright, but to stay ahead, a robust supply chain will be needed.

Electronic components distributors like Cyclops are helping supply meet demand, while the communications sector battles to secure chip orders. Call us today at +44 (0) 01904 415 415 or email sales@cyclops-electronics.com 

Tags: communication automotive ics 5g edge computing internet of things components ic demand modems memory and antennas artificial intelligence machine learning data analytics integrated circuits


07 April 2021

NXP Announces i.MX 9 and i.MX 8 processor line for Intelligent Multi-sensor Applications

NXP

NXP Semiconductors has announced a new line of edge processors that deliver a giant leap in performance and security at the edge.

As edge computing rapidly evolves around us and demand for edge computing soars, performance demands are increasing at an exponential rate. This requires a new approach to security, power consumption and performance. Existing edge processors offer a solution now but are not ready for the next generation of real-time data.

Technologies like machine learning, artificial intelligence, robotics, autonomous driving and next-gen wireless infrastructure all depend on the edge. NXP Semiconductors is meeting the challenge with new i.MX 9 and i.MX 8 processor lines.

i.MX 8ULP and i.MX 8ULP-CS

The ultra-low power i.MX 8ULP and i.MX 8ULP-CS (cloud secured) Microsoft Azure Sphere-certified processors have the EdgeLock secure enclave, a pre-configured security subsystem that simplifies complex security technologies and helps designers avoid costly errors. It automates the following security functions:

  • Root of trust
  • Run-time attestation
  • Trust provisioning
  • Secure boot
  • Key management
  • Cryptographic services

The i.MX 8ULP-CS is Microsoft Azure Sphere-certified with Microsoft Pluton enabled on EdgeLock for highly secure hardware. With Azure Sphere, it has chip-to-cloud security built in, enabling use in a wide range of applications.

Both i.MX processors utilise Energy Flex architecture, which delivers as much as 75% improved energy efficiency compared to previous generations.

They have heterogeneous domain processing and 28nm FD-SOI process technology, making them among the most advanced edge chips in the world. The processors have one or two 1GHz Arm Cortex-A35 processors, a 216MHz Cortex-M33 real-time processor and a 200MHz Fusion DSP for low-power voice and sensor hub processing.

Every Azure Sphere-certified i.MX 8ULP-CS device also gets ongoing OS and security improvements for over ten years.

i.MX 9

The i.MX 9 series is NXP Semiconductors’ range-topping high-performance edge processor for intelligent multi-sensor applications.

The i.MX 9 debuts a new generation of processors that have an independent MCU-like real-time domain and dedicated multi-sensory data processing engines for graphics, image, display, audio and voice. The i.MX 9 series also features EdgeLock secure enclave, Energy Flex architecture and hardware neural processing.

The i.MX 9 is for the next generation of edge computing applications including machine learning and artificial intelligence. It’s the first NXP line to use the Arm Ethos U-65 microNPU which enables low-power machine learning.

Importantly, Azure Sphere chip-to-cloud security is enabled within the i.MX 9 line, providing a clear upgrade path from the i.MX 8 series.

EdgeLock secure enclave is the big ticket item of the new processor lines, combining complex security technologies into a single pre-configured platform. With device-wide security intelligence, it provides a simplified path to certification, enabling non-stop trusted management services and applications.

So what?

With the release of these new processors, organisations of any size can now pursue IoT development and real-time technologies with the confidence that NXP and Microsoft have laid out a foundation of security via Microsoft Azure. The low-power requirements and chip-to-cloud security deliver innovation in the right areas.

You can find out more about the processors here.

If you are looking for NXP parts contact us today! sales@cyclops-electronics.com 

Tags: edge computing machine learning artificial intelligence robotics wireless infrastructure nxp semiconductors iot


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