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Showing posts tagged 'nxp'


26 May 2021

Who are the biggest players in the semiconductor industry?

semiconductor 2

Over the next decade, demand for semiconductors is going to go supersonic thanks to secular and cyclical tailwinds.

Semiconductors are the building blocks of the information age; every device that will be ‘connected’ needs a semiconductor. The companies that manufacture semiconductors are the unsung heroes of the future. But who are they?

In this article, we will briefly cover the biggest players in the semiconductor industry.

Foundries

Foundries concentrate on manufacturing and testing physical products for fabless companies. Some companies, like Intel, are both fabless and foundry, meaning they design and make their chips. Foundries often serve as a non-competitive manufacturing partner for fabless companies. The following list contains the biggest foundries:

TSMC

TSMC (Taiwan Semiconductor Manufacturing Company) is the world’s largest semiconductor manufacturer by a significant margin. They are expected to capture 56% of the semiconductor market in 2021 (up from 54% in 2020). 

UMC

UMC (United Microelectronics Corporation) is a Taiwanese company. They are the second largest semiconductor foundry in the world behind TSMC. UMC specialise in mature nodes, such as 40nm nodes and other speciality logic.

SMIC

SMIC (Semiconductor Manufacturing International Corporation) is a Chinese company. They are the third largest semiconductor manufacturer in the world. They specialise in process nodes from 0.35 micron to 14 nanometres.

Samsung

Samsung Electronics is a South Korean company. They are the world’s largest manufacturer of DRAM and the world’s fourth largest semiconductor manufacturer. They are expected to occupy 18% of the semiconductor market in 2021.  

Micron

Micron is an American company. They are the second largest manufacturer of DRAM (dynamic random-access memory) behind Samsung. DRAM is semiconductor memory used in consumer electronics, computing equipment and IoT devices.

SK Hynix

SK Hynix is a South Korean company. They are the world’s third largest manufacturer of DRAM and a leading manufacturer of NAND flash memory. In 2019, they developed HBM2E, the world’s fastest high bandwidth memory.

NXP Semiconductors

NXP Semiconductors is a Dutch-American company. They manufacture ARM-based processors, microprocessors and logic across 8, 16 and 32-bit platforms. Their products are used in automotive, consumer, and industrial markets.

Powerchip

Powerchip Technology Corporation is a Taiwanese company. They manufacture DRAM and memory chips, semiconductors and integrated circuits. They use a 300mm wafer production technology which can produce advanced and mature chips.

ON Semiconductor

ON Semiconductor is an American company. They design and fabricate chips and microprocessors for automotive, aerospace, industrial, cloud and Internet of Things devices. They have over 45 years’ of experience in the foundry business.

Fabless companies

“Fabless” means outsourced fabrication. Fabless companies concentrate on the research and development of chips and semiconductors. They then outsource the manufacturing of the product to a foundry. This relationship is non-competitive, and the foundry is normally a silent partner. The following list contains the biggest fabless companies:

MediaTek

MediaTek is a Taiwanese company. By market share, they are the world’s leading vendor of smartphone chipsets. They are also a leading vendor of chipsets for other consumer electronics including tablets and connected TVs.

Qualcomm

Qualcomm is an American company. They are the world’s biggest fabless company. Their product catalogue includes processors, modems, RF systems, 5G, 4G and legacy connectivity solutions. They are best-known for Snapdragon Series processors.

Broadcom

Broadcom is an American company. Depending on which figures you read, they are either the first or second largest fabless company in the world. Broadcom's products serve the data centre, networking, software, broadband, wireless, and storage and industrial markets.

NVIDIA

NVIDIA is an American company. They are the market leader for high-end graphics processing units (GPUs). In 2020, NVIDIA GeForce GPUs accounted for 82% of GPU market share. This is significantly more than AMD Radeon graphics cards, which accounted for 18%.

AMD

AMD is an American company. They design high-performance GPUs and processors for computers, where they command the second biggest market share behind Intel. Their GPUs compete against NVIDIA’s but are not considered as powerful.

Himax

Himax is a Taiwanese company. They are a leading vendor of automotive chips and semiconductors for connected devices. Their semiconductors are used in TVs, monitors, laptops, virtual reality headsets, cameras and much more.

Realtek

Realtek is a Taiwanese company. They are a fabless semiconductor company focused on developing IC products (integrated circuits). They are best-known for SoCs (System-on-Chips) network (Ethernet) and wireless (Wi-Fi) interface controllers.

Integrated device manufacturers

Some companies have foundry and fabless arms. These companies often design and fabricate their own products or design and fabricate chips for others. These integrated device manufacturers (IDMs for short) blur the line between foundry and fabless with an in-house production process that utilises little if any outsourcing. IDMs include:

Intel

Intel is an American company. They design and manufacture their own chips which they package into CPUs. Intel’s market share in the CPU market has declined in recent years, but they remain one of the top semiconductor manufacturers.

Analog Devices

Analog Devices is an American company. They have a 150mm wafer fab and a 200mm wafer fab. They have fabless production facilities and have made numerous fabless acquisitions over the years, such as OneTree Microdevices in 2017.

Texas Instruments

Texas Instruments is an American company. They have 14 manufacturing sites including silicon foundries. They specialise in the production and manufacture of wafers, digital signal processors, integrated circuits and embedded processors.

Overall

You may have noticed that the US and Taiwan dominate the semiconductor industry on the foundry and fabless side. Among the biggest semiconductor companies, the largest proportion are based in the United States. However, Taiwan is the foundry king, with the two biggest players based there (TSMC and UMC).

Semiconductors are used in all electronics that require computing power, including smartphones, PCs, and data centres and cars. A surge in demand for chip-based products will fuel the need for more semiconductors in the future. It will be up to the big players on this list to meet that demand and power our future.

Tags: semiconductors foundries tsmc umc smic samsung micron sk hynix nxp semiconductors powerchip on semiconductor fabless companies mediatek qualcomm broadcom nvidia amd himax realtek intel analog devices texas instruments


06 May 2021

Top Manufacturer Lead Time Update

Click the image below to view our full top manufacturers' lead time update. 

Need help finding those hard-to-find and obsolete components? 

Get in touch today!

Call: 01904 415 415

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Tags: 2021 leadtime forecast fujitsu infineon micron nxp on semiconductor samsung st texas instruments toshiba vishay manufacturer advanced analog discrete and lighting standard logic and linear volatile memory non-volitile memory embedded pr


07 April 2021

NXP Announces i.MX 9 and i.MX 8 processor line for Intelligent Multi-sensor Applications

NXP

NXP Semiconductors has announced a new line of edge processors that deliver a giant leap in performance and security at the edge.

As edge computing rapidly evolves around us and demand for edge computing soars, performance demands are increasing at an exponential rate. This requires a new approach to security, power consumption and performance. Existing edge processors offer a solution now but are not ready for the next generation of real-time data.

Technologies like machine learning, artificial intelligence, robotics, autonomous driving and next-gen wireless infrastructure all depend on the edge. NXP Semiconductors is meeting the challenge with new i.MX 9 and i.MX 8 processor lines.

i.MX 8ULP and i.MX 8ULP-CS

The ultra-low power i.MX 8ULP and i.MX 8ULP-CS (cloud secured) Microsoft Azure Sphere-certified processors have the EdgeLock secure enclave, a pre-configured security subsystem that simplifies complex security technologies and helps designers avoid costly errors. It automates the following security functions:

  • Root of trust
  • Run-time attestation
  • Trust provisioning
  • Secure boot
  • Key management
  • Cryptographic services

The i.MX 8ULP-CS is Microsoft Azure Sphere-certified with Microsoft Pluton enabled on EdgeLock for highly secure hardware. With Azure Sphere, it has chip-to-cloud security built in, enabling use in a wide range of applications.

Both i.MX processors utilise Energy Flex architecture, which delivers as much as 75% improved energy efficiency compared to previous generations.

They have heterogeneous domain processing and 28nm FD-SOI process technology, making them among the most advanced edge chips in the world. The processors have one or two 1GHz Arm Cortex-A35 processors, a 216MHz Cortex-M33 real-time processor and a 200MHz Fusion DSP for low-power voice and sensor hub processing.

Every Azure Sphere-certified i.MX 8ULP-CS device also gets ongoing OS and security improvements for over ten years.

i.MX 9

The i.MX 9 series is NXP Semiconductors’ range-topping high-performance edge processor for intelligent multi-sensor applications.

The i.MX 9 debuts a new generation of processors that have an independent MCU-like real-time domain and dedicated multi-sensory data processing engines for graphics, image, display, audio and voice. The i.MX 9 series also features EdgeLock secure enclave, Energy Flex architecture and hardware neural processing.

The i.MX 9 is for the next generation of edge computing applications including machine learning and artificial intelligence. It’s the first NXP line to use the Arm Ethos U-65 microNPU which enables low-power machine learning.

Importantly, Azure Sphere chip-to-cloud security is enabled within the i.MX 9 line, providing a clear upgrade path from the i.MX 8 series.

EdgeLock secure enclave is the big ticket item of the new processor lines, combining complex security technologies into a single pre-configured platform. With device-wide security intelligence, it provides a simplified path to certification, enabling non-stop trusted management services and applications.

So what?

With the release of these new processors, organisations of any size can now pursue IoT development and real-time technologies with the confidence that NXP and Microsoft have laid out a foundation of security via Microsoft Azure. The low-power requirements and chip-to-cloud security deliver innovation in the right areas.

You can find out more about the processors here.

If you are looking for NXP parts contact us today! sales@cyclops-electronics.com 

Tags: edge computing machine learning artificial intelligence robotics wireless infrastructure nxp semiconductors iot


17 July 2015

NewPass Project

A number of European semiconductor firms are working on an ambitious project called NewP@ss which aims to develop next generation e-passports in the EU.

NXP, Infineon and STMicroelectronics are working together on the project creating advanced microelectronics, embedded software and secure platforms for the project.

This is more than just creating a new online passport – it’s a whole system of next generation travel documents. More and more people are checking in online when going abroad or using their smartphones for e-tickets etc. The NewP@ss system is looking at integrating all of this together in one place.

As well as the usual information found on a passport now, the system would also have the ID holder’s biometric data, travel documents such as visas and also arrival and departure stamps. The system would also be easier to update and make changes to rather than reissuing an entirely new passport for name changes or address changes.

There are multiple challenges facing the team from security and safety to convenience and ease of use. Of course security is a huge concern where passports are concerned and this is the number one priority for the companies involved. They are working on highly advanced embedded software platforms and secure 32 bit microcontrollers to run it all.

This is a huge task which will hopefully make travelling around Europe much easier and more secure for us all. The new systems will be introduced gradually, starting this year and running until 2020 and beyond.

Source: NewP@ss Project

Tags: newp@ss passports nxp infineon stmicroelectronics


02 March 2015

Merger Announced between NXP & Freescale

 
NXP has merged with Freescale to create a super company worth a staggering $40 billion!! The two companies will work together to provide near field communication items and portable devices.

“Today’s announcement is a transformative step in our objective to become the industry leader in high performance mixed signal solutions. The combination of NXP and Freescale creates an industry powerhouse focused on the high growth opportunities in the Smarter World.” said Richard Clemmer, NXP Chief Executive Officer. Mr. Clemmer will continue to be the President and Chief Executive Officer of the merged company.

“We believe this merger, which combines two highly successful and complementary companies, will create significant value for Freescale’s and NXP’s shareholders, customers and employees. Both companies have built leadership positions and have a sharp focus on delivering superior value to customers.” said Gregg Lowe, Freescale Semiconductor President and Chief Executive Officer.

The industry focus on connectivity and The Internet of Things is a huge driver for both companies. The combined products and innovations of these two will lead to very exciting developments in the semiconductor industry!

Keep up to date with all the latest industry news by following us on Twitter, Google + and LinkedIn.

Tags: nxp freescale


13 January 2015

CES 2015 Semiconductor Round Up

Lots of really interesting and innovative things have come out of CES 2015, particularly in regards to new semiconductor releases. Here's a quick round up of some of the big chip releases:

Intel

Broadwell 5th Generation

This is the 5th Generation 14nm Broadwell Y Dual core which has been highly anticipated for some time now, but the results don't disappoint! It will increase battery life by up to 1.5 hours, will run faster and is more energy efficient than previous generation models. The die size has shrunken 37% and can fit 35 more transistors than other Intel chips.

The Broadwell 5th Gen chips should be ready to ship later this month and are ideal for the 2in1 laptop and tablet devices which are increasing in popularity. Intel are also expanding their Pentium and Celeron CPU ranges and further foraying into the wearable device world with Fossil and Oakley.

ON Semiconductor

3D Sensors

ON Semiconductor have been working with 3D stacking technology to create better 3D image sensors. Using stacking technology gives a smaller die and means each part of the sensor can be optimised, so they have improved pixel performance and better power consumption.

“3D stacking technology is an exciting breakthrough that enhances our ability to optimize ON Semiconductor’s future sensors,” said Sandor Barna, vice president of Technology for ON Semiconductor’s Image Sensor Group. “This technology provides manufacturing and design flexibility to ensure continued performance leadership across our entire sensor product portfolio.”

Nvidia

Super Chip

The Tegra X1 Superchip packs a humongous 1 Teraflop of processing power into a device the size of a thumbnail and uses under 10 watts of power. The Tegra X1 is twice as powerful as Nvidia's previous superchip, the Tegra K1, rendering 4k at 60Hz. This superchip should begin appearing in the first half of the year and has been designed for use in

Tegra X1's technical specifications include:

  • 256 core Maxwell GPU
  • 8CPU cores
  • 60 fps 4K video (H.265, H.264, VP9)
  • 1.3 gigapixel of camera throughput
  • 20nm process

NXP

Passive Keyless Entry

The NCF29A1 is primarily being used for Passive Keyless Entry for cars, It is a radio frequency transmitter and immobilizer in one. This chip can allow for extra features to be added to car remote keys such as auto locking when walking away from the vehicle and even a welcome light when approaching!

The NCF29A1 has longer ranger, lower power consumption, 40% longer battery life and 70% smaller form factor than previous chips. This smaller size and better battery life means PKE can be built into smartphones and wearable tech so you never have to worry about losing your car keys again!

Texas Instruments

Voice Control

Texas Instruments are working with Comcast on their Xfinity remote control, which uses TI's voice-over-RF4CE™ ZigBee® remote control technology to allow voice control to search for channels, shows and set DVR Recordings. No more pushing buttons and endlessly searching for what you want to watch – just say what you are looking for and it will appear on screen as if by magic!

You can purchase a huge range of semiconductors from Cyclops Electronics. Currently we have 144, 576 stocked line items and have access to over 600,000,000 more! Use our Fast Component Search to find the parts you need then call or email to place your order.

Keep up to date with all the latest industry news by following us on Twitter, liking us on Facebook and connecting on LinkedIn.

Tags: broadwell ces 2015 intel nvidia nxp on semiconductor semiconductor industry texas instruments


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